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DAS unveils MIA platform

DAS unveils MIA platform
MIA-X10

DAS unveils MIA platform

DAS Audio has introduced the MIA Series, an installation platform comprising loudspeakers, amplification, processing and control tools designed to operate within a single environment. The range includes seven passive coaxial point source loudspeakers and two low-profile subwoofers. Models span 5- to 12-inch formats, with varying output levels and coverage patterns for applications ranging from distributed audio to installations requiring greater output and directivity control.

The MIA-X5 and MIA-X6 provide 120° conical coverage, while the MIA-X8 offers 110°. The MIA-X10 and MIA-X12 are available with 70° x 50° or 110° x 60° coverage patterns via rotatable waveguides that can be adjusted to suit installation requirements. The MIA-X5 and MIA-X6 feature a nominal impedance of 16Ω, allowing up to eight loudspeakers to be connected per channel when used with the recommended INTEGRAL-MA matrices.

MIA-S110
MIA-S110

Low-frequency support is provided by the MIA-S110 and MIA-S115 subwoofers. Their low-profile band-pass enclosures can be installed horizontally or vertically, while the MIA-S110 also supports wall mounting via an optional accessory.

The accompanying INTEGRAL-MA range comprises six amplified matrices with 2- and 4-channel configurations, delivering between 250W and 750W per channel at 4Ω. Each unit combines Class-D amplification, DSP, an audio matrix and 4x4 Dante/AES67 connectivity, enabling signal routing, zoning, priority management and output processing from a single platform.

Factory presets incorporating FIR filters and limiters have been developed for each MIA model, enabling different loudspeakers from the series to be combined within the same installation.

System configuration, control and monitoring are managed through ALMA software. The INTEGRAL-MA1002, MA1502, MA2004 and MA3004 also feature an integrated web server with ALMAweb for browser-based management. The matrices support low-impedance, 70V and 100V systems and can be integrated with third-party platforms via OSC and GPIO.

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